Mobile Hardware and Chip-Level Repair Engineer (Contract – Immediate Joiner)
Sirma Business Consulting India Private Limited
Job Description
ob Title: Mobile Hardware & Chip-Level Repair Engineer (Contract – Immediate Joiner)
Location: Brookefield, Bangalore (Onsite)
Job Type: Contract
Contract Duration: 7 to 15 Days
Joining: Immediate Joiner Required
Job Description:
We are looking for an experienced Mobile Hardware & Chip-Level Repair Engineer for a short-term onsite contract in Brookefield, Bangalore. The candidate must have complete knowledge of smartphone repair including hardware, software, soldering, and motherboard-level repair. The candidate should be able to independently diagnose and repair Android and iPhone devices.
Key Responsibilities:
Diagnose and repair hardware and software issues in smartphones (Android and iPhone)
Perform chip-level repair including soldering and micro-soldering